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Daniel Artusi can look back on more than 40 years of experience in the semiconductor industry. After holding management positions at various semiconductor and technology companies such as Conexant Systems, Coldwatt, Inc., Silicon Laboratories, Motorola Inc and Lantiq Deutschland GmbH, he was most recently Vice President in the Client Computing Group and General Manager for the Connected Home division of Intel Corporation. He also serves on various boards, including MaxLinear, Inc., Minim, GenXComm, VislC-Tech and on the Engineering Advisory Board of the Cockrell School of Engineering (University of Texas).
Daniel is convinced by the FMC team and the superior technology.
I look forward to working with Ali and the rest of the FMC team. FMC has developed a unique and patented technology for transforming amorphous HfO2 into crystalline ferroelectric HfO2, which can offer superior performance compared with state-of-the-art and emerging memory solutions. This technology will bring significant benefits to applications such as AI and 5G, Big Data, which require high-performance and low power consumption as well compatibility with leading-edge CMOS logic processes.
Daniel Artusi, Chairman Board of Directors, FMC GmbH
Dan is a veteran in the semiconductor industry and we are proud to have been able to attract him to work with us. His immense experience and market knowledge will be of great benefit to FMC as we take the next steps towards commercialising the technology.
Paul-Josef Patt, CEO of the lead investor eCAPITAL AG
Ali Pourkeramati, CEO of FMC GmbH, is looking forward to the future cooperation.
Dan brings a wealth of industry experience to our board. His extensive strategy and leadership experience in the semiconductor industry will benefit FMC as we accelerate commercialization of our leading-edge ferroelectric memory.
Ali Pourkeramati, CEO, FMC GmbH
About Ferroelectric Memory GmbH (FMC)
FMC has developed the most advanced ferroelectric hafnium oxide memory technology to deliver leading-edge non-volatile memory for future electronics and computing innovation. The company emerged from stealth mode in July 2018 and is currently working with major semiconductor companies for its embedded and stand-alone memory solution. Its ferroelectric field-effect transistor (FeFET) and capacitor (FeCAP) technology is simple to integrate, fast, low-power, and scalable, and has high endurance with decades of data retention, suitable for a broad range of AI, IoT, edge, data center, and embedded applications. www.ferroelectric-memory.com
eCAPITAL is a venture capital firm that provides early to growth stage funding to technology companies in the fields of software & information technology, cybersecurity, industry 4.0, new materials and cleantech. Founded in 1999, eCAPITAL has a history of supporting entrepreneurs determined to build companies with lasting significance. Partnering with eCAPITAL means joining an international network of business leaders, entrepreneurs, technologists and potential partners. eCAPITAL is located in Germany, currently manages funds with over EUR 280 million under management and was lead investor of some very successful German exits like sonnen, Novaled or Jedox.
Ferroelectric Memory GmbH
01109 Dresden, Germany